Staff Failure Analysis Engineer

As a member of the NAND Failure Analysis team, you will electrically and physically characterize NAND flash memory devices to determine the root causes of failures and drive product and technology improvements. You will apply semiconductor device physics, electrical characterization, and data analysis to solve complex technical challenges while working closely with design, device, process integration, product, reliability, and test engineering teams.

Responsibilities:

• Investigate and characterize NAND flash memory devices to determine the root causes of failures and identify opportunities for product and technology improvement.
• Perform detailed electrical analysis for fault isolation and defect characterization using a variety of analytical tools, including in-house testers, oscilloscopes, curve tracers, circuit schematics, and layout analysis.
• Utilize physical analysis techniques to validate electrical findings and characterize defects.
• Develop failure models, interpret results from electrical and physical analysis, and communicate findings and recommendations to internal customers.
• Collaborate with design, device, process integration, product, reliability, and test engineering teams to improve product quality, manufacturing yield, test coverage, and device reliability.
• Develop new methodologies, automation tools, and laboratory capabilities to improve failure analysis effectiveness and efficiency.

Qualifications:

Required

• M.S. or Ph.D. degree in Electrical Engineering, Materials Science & Engineering, Physics, Computer Engineering, or a related field
• 6+ years of relevant industry experience with an M.S. degree or 3+ years with a Ph.D. degree
• Strong understanding of semiconductor device physics
• Experience characterizing and analyzing semiconductor devices through electrical measurements, experimentation, and data analysis
• Experience using Python for data analysis, automation, or engineering workflow development
• Strong written and verbal communication skills, including presentation of technical findings to cross-functional teams
• Knowledge of electronic circuits

Preferred

• Experience with advanced packaging technologies including TSVs, 2.5D, or 3D integration
• Experience in semiconductor failure analysis, product engineering, reliability engineering, device engineering, process integration, test engineering, or semiconductor processing
• Experience with electrical or physical characterization techniques
• Experience with AI/ML tools and concepts